Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors

Author:

Kim Yeongin123ORCID,Suh Jun Min12ORCID,Shin Jiho12,Liu Yunpeng12ORCID,Yeon Hanwool124,Qiao Kuan12ORCID,Kum Hyun S.125ORCID,Kim Chansoo12ORCID,Lee Han Eol126ORCID,Choi Chanyeol7ORCID,Kim Hyunseok12ORCID,Lee Doyoon12ORCID,Lee Jaeyong1,Kang Ji-Hoon2ORCID,Park Bo-In2ORCID,Kang Sungsu8ORCID,Kim Jihoon8ORCID,Kim Sungkyu9ORCID,Perozek Joshua A.7ORCID,Wang Kejia110ORCID,Park Yongmo1ORCID,Kishen Kumar1ORCID,Kong Lingping1,Palacios Tomás7ORCID,Park Jungwon811ORCID,Park Min-Chul12ORCID,Kim Hyung-jun1213,Lee Yun Seog14ORCID,Lee Kyusang15,Bae Sang-Hoon116,Kong Wei117ORCID,Han Jiyeon18ORCID,Kim Jeehwan1219ORCID

Affiliation:

1. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.

2. Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.

3. Department of Electrical Engineering and Computer Science, University of Cincinnati, Cincinnati, OH 45219, USA.

4. School of Materials Science and Engineering, Gwangju Institute of Science and Technology, Gwangju 61005, South Korea.

5. Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, South Korea.

6. Division of Advanced Materials Engineering, Jeonbuk National University, Jeonju 54896, South Korea.

7. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.

8. School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University, Seoul 08826, South Korea.

9. Department of Nanotechnology and Advanced Materials Engineering, Sejong University, Seoul 05006, South Korea.

10. School of Micro-Nano Electronics, Zhejiang University, Hangzhou 311200 Zhejiang, People’s Republic of China.

11. Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, South Korea.

12. Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology (KIST), Seoul 02792, South Korea.

13. Division of Nano and Information Technology, KIST School, Korea University of Science and Technology, Seoul 02792, South Korea.

14. Department of Mechanical Engineering, Seoul National University, Seoul 08826, South Korea.

15. Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA 22904, USA.

16. Department of Mechanical Engineering and Materials Science, Institute of Materials Science and Engineering, Washington University in St. Louis, MO 63139, USA.

17. Department of Materials Science and Engineering, Westlake University, Hangzhou 310024 Zhejiang, People’s Republic of China.

18. Skincare Division, Amorepacific R&D Center, Yongin 17074, South Korea.

19. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.

Abstract

Recent advances in flexible and stretchable electronics have led to a surge of electronic skin (e-skin)–based health monitoring platforms. Conventional wireless e-skins rely on rigid integrated circuit chips that compromise the overall flexibility and consume considerable power. Chip-less wireless e-skins based on inductor-capacitor resonators are limited to mechanical sensors with low sensitivities. We report a chip-less wireless e-skin based on surface acoustic wave sensors made of freestanding ultrathin single-crystalline piezoelectric gallium nitride membranes. Surface acoustic wave–based e-skin offers highly sensitive, low-power, and long-term sensing of strain, ultraviolet light, and ion concentrations in sweat. We demonstrate weeklong monitoring of pulse. These results present routes to inexpensive and versatile low-power, high-sensitivity platforms for wireless health monitoring devices.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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