1. Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
2. Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
3. Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
4. AML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China
5. Center for Mechanics and Materials, Center for Flexible Electronics Technology, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
6. Department of Electronics Convergence Engineering, Kwangwoon University, Seoul 01897, Republic of Korea
7. Division of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea
8. Institute for Molecular Engineering, The University of Chicago, Chicago, Illinois 60637, United States
9. Department of Mechanical Engineering, Ajou University, Suwon, 443-749, Republic of Korea
10. Weldon School of Biomedical Engineering, School of Mechanical Engineering, The Center for Implantable Devices, and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, United States
11. School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
12. Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea