Heterogeneous Three-Dimensional Electronics by Use of Printed Semiconductor Nanomaterials

Author:

Ahn Jong-Hyun12345,Kim Hoon-Sik12345,Lee Keon Jae12345,Jeon Seokwoo12345,Kang Seong Jun12345,Sun Yugang12345,Nuzzo Ralph G.12345,Rogers John A.12345

Affiliation:

1. Department of Materials Science and Engineering, University of Illinois, Urbana-Champaign, IL 61801, USA.

2. Beckman Institute for Advanced Science and Technology, University of Illinois, Urbana-Champaign, IL 61801, USA.

3. Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, IL 61801, USA.

4. Department of Chemistry, University of Illinois, Urbana-Champaign, IL 61801, USA.

5. Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, IL 61801, USA.

Abstract

We developed a simple approach to combine broad classes of dissimilar materials into heterogeneously integrated electronic systems with two- or three-dimensional layouts. The process begins with the synthesis of different semiconductor nanomaterials, such as single-walled carbon nanotubes and single-crystal micro- and nanoscale wires and ribbons of gallium nitride, silicon, and gallium arsenide on separate substrates. Repeated application of an additive, transfer printing process that uses soft stamps with these substrates as donors, followed by device and interconnect formation, yields high-performance heterogeneously integrated electronics that incorporate any combination of semiconductor nanomaterials on rigid or flexible device substrates. This versatile methodology can produce a wide range of unusual electronic systems that would be impossible to achieve with other techniques.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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