Extreme-Pressure Imprint Lithography for Heat and Ultraviolet-Free Direct Patterning of Rigid Nanoscale Features-Reference-Cited by-同舟云学术

Extreme-Pressure Imprint Lithography for Heat and Ultraviolet-Free Direct Patterning of Rigid Nanoscale Features

Published:2021-06-11 Issue:6 Volume:15 Page:10464-10471
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Park Woon Ik¹^ORCID,Park Tae Wan²,Choi Young Joong²,Lee Sangryun³,Ryu Seunghwa³^ORCID,Liang Xiaogan⁴^ORCID,Jung Yeon Sik⁵^ORCID

Affiliation:

1. Department of Materials Science and Engineering, Pukyoung National University (PKNU), 45 Yongso-ro, Nam-gu, Busan 48513, Republic of Korea

2. Electronic Convergence Materials Division, Korea Institute of Ceramic Engineering & Technology (KICET), 101 Soho-ro, Jinju 52851, Republic of Korea

3. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea

4. Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109, United States

5. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea

Funder

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsnano.1c02896

Reference46 articles.

1. Imprint Lithography with 25-Nanometer Resolution

2. SOFT LITHOGRAPHY

3. Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability