Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability

Author:

Park Tae Wan12ORCID,Byun Myunghwan3ORCID,Jung Hyunsung1ORCID,Lee Gyu Rac4,Park Jae Hong56,Jang Hyun-Ik56ORCID,Lee Jung Woo7,Kwon Se Hun7ORCID,Hong Seungbum4ORCID,Lee Jong-Heun2ORCID,Jung Yeon Sik4ORCID,Kim Kwang Ho78ORCID,Park Woon Ik9ORCID

Affiliation:

1. Electronic Convergence Materials Division, Korea Institute of Ceramic Engineering & Technology (KICET) 101 Soho-ro, Jinju 52851, Republic of Korea.

2. Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea.

3. Department of Advanced Materials Engineering, Keimyung University, 1095 Dalgubeol-daero, Daegu 42601, Republic of Korea.

4. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.

5. Division of Nano-Convergence Technology, Korea National NanoFab Center (NNFC), 291 Daehak-ro, Daejeon 34141, Republic of Korea.

6. NanoIn-Inc, 291 Daehak-ro, Korea National NanoFab Center (NNFC), Daejeon 34141, Republic of Korea.

7. School of Materials Science and Engineering, Pusan National University (PNU), Busandaehak-ro 63beon-gil, Geumjeong-gu, Busan 46241, Republic of Korea.

8. Global Frontier R&D Center for Hybrid Interface Materials (HIM), Busandaehak-ro 63beon-gil, Geumjeong-gu, Busan 46241, Republic of Korea.

9. Department of Materials Science and Engineering, Pukyoung National University (PKNU), 45 Yongso-ro, Nam-gu, Busan 48513, Republic of Korea.

Abstract

Thermally assisted nanotransfer printing process enables nanopattern formation at an 8-inch wafer.

Funder

National Research Foundation of Korea

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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