Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging-Reference-Cited by-同舟云学术

Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging

Published:2021-03-23 Issue:13 Volume:13 Page:15791-15801
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Liu Peng¹,Luo Yingying¹,Liu Jiaman²,Chiang Sum Wai²,Wu Dang¹,Dai Wanyu¹,Kang Feiyu¹,Lin Wei³,Wong Ching-Ping³^ORCID,Yang Cheng¹^ORCID

Affiliation:

1. Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China

2. Shenzhen Environmental Science and New Energy Technology Engineering Laboratory, Tsinghua-Berkeley Shenzhen Institute (TBSI), Tsinghua University, Shenzhen 518055, China

3. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, Georgia 30332, United States

Funder

Guangdong Science and Technology Department

National Natural Science Foundation of China

Tsinghua Shenzhen International Graduate School Overseas Collaboration Project

Shenzhen Geim Graphene Center, Tsinghua-Berkeley Shenzhen Institute

Shenzhen Municipal Government

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.0c22434

Reference40 articles.

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4. Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

5. High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

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