Deposition of Copper Films with Surface-Activating Agents
Author:
Affiliation:
1. Central Research and Development Department, E. I. du Pont de Nemours and Company, Wilmington, Delaware 19880-0500, United States
Publisher
American Chemical Society (ACS)
Subject
Inorganic Chemistry,Organic Chemistry,Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/om3005383
Reference58 articles.
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3. The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing
4. Atomic layer deposition (ALD): from precursors to thin film structures
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