Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation
Author:
Affiliation:
1. Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138, United States
2. John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, United States
Funder
Air Force Office of Scientific Research
Office of Science
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.7b01327
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