Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials
Author:
Affiliation:
1. NG Next, Northrop Grumman Corporation, One Space Park, Redondo Beach, California 90278, United States
2. Stanford University, Stanford, California 94305, United States
Funder
Division of Engineering Education and Centers
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.7b12313
Reference40 articles.
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4. Recently emerging trends in thermal conductivity of polymer nanocomposites
5. Nanowire-filled polymer composites with ultrahigh thermal conductivity
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