Fabrication and Performance Evaluation of Double-Sided Copper Nanowire Arrays as Thermal and Electrical Interfacial Layers-Reference-Cited by-同舟云学术

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Fabrication and Performance Evaluation of Double-Sided Copper Nanowire Arrays as Thermal and Electrical Interfacial Layers

Published:2024-08-08 Issue: Volume: Page:
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Zhu Long¹^ORCID,Li Tianlei²,Wang Hsin³,Kumara Chanaka³,Gao Weixiao¹,Ren Fei¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, Temple University, Philadelphia, Pennsylvania 19122, United States

2. Honeywell International, 1598 Foothill Drive, Boulder City, Nevada 89005, United States

3. Materials Science and Technology Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831, United States

Funder

Solar Energy Technologies Office

Vehicle Technologies Office

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.4c00797

Reference26 articles.

1. Nanoscale thermal transport

2. Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder

3. Double-sided tin nanowire arrays for advanced thermal interface materials

4. Novel nanostructured thermal interface materials: a review

5. Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials

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