Novel Conductive Filament Metal–Interlayer–Semiconductor Contact Structure for Ultralow Contact Resistance Achievement
Author:
Affiliation:
1. School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Korea
2. Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, Texas 75080, United States
Funder
National Research Foundation of Korea
Ministry of Trade, Industry and Energy
Samsung Electronics
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.8b07066
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