Parameters Affecting Interfacial Assembly and Alignment of Nanotubes-Reference-Cited by-同舟云学术

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Parameters Affecting Interfacial Assembly and Alignment of Nanotubes

Published:2023-09-27 Issue:40 Volume:39 Page:14433-14440
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Jinkins Katherine R.¹^ORCID,Dwyer Jonathan H.²,Suresh Anjali¹,Foradori Sean M.¹^ORCID,Gopalan Padma¹³^ORCID,Arnold Michael S.¹

Affiliation:

1. Department of Materials Science and Engineering, University of Wisconsin-Madison, 1509 University Avenue, Madison, Wisconsin 53706, United States

2. Department of Chemical and Biological Engineering, University of Wisconsin–Madison, 1415 Engineering Dr., Madison, Wisconsin 53706, United States

3. Department of Chemistry, University of Wisconsin–Madison, 1101 University Avenue, Madison, Wisconsin 53706, United States

Funder

Division of Graduate Education

Office of Naval Research

University of Wisconsin-Madison

National Science Foundation

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.3c02000

Reference29 articles.

1. Carbon nanotube transistors scaled to a 40-nanometer footprint

2. Carbon nanotube electronics

3. Ballistic carbon nanotube field-effect transistors

4. Toward High-Performance Digital Logic Technology with Carbon Nanotubes

5. Nanotube electronics for radiofrequency applications

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Assembly and Alignment of High Packing Density Carbon Nanotube Arrays Using Lithographically Defined Microscopic Water Features;ACS Nano;2024-03-04

2. Aligned Arrays of Semiconducting HiPCO SWCNTs Prepared by Liquid–Liquid Interface Confinement Self-Assembly for Optic–Electronic Applications;ACS Applied Nano Materials;2024-02-01

3. Small Molecule Additives to Suppress Bundling in Dimensional‐Limited Self‐Alignment Method for High‐Density Aligned Carbon Nanotube Array;Advanced Materials Interfaces;2023-12-17

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