Realization of Micropatterned, Narrow Line-Width Ni–Cu–Sn Front Contact Grid Pattern Using Maskless Direct-Write Lithography for Industrial Silicon Solar Cells-Reference-Cited by-同舟云学术

Realization of Micropatterned, Narrow Line-Width Ni–Cu–Sn Front Contact Grid Pattern Using Maskless Direct-Write Lithography for Industrial Silicon Solar Cells

Published:2021-09-17 Issue:10 Volume:4 Page:10682-10696
ISSN:2574-0962
Container-title:ACS Applied Energy Materials
language:en
Short-container-title:ACS Appl. Energy Mater.

Author:

Aleem Mahaboobbatcha¹,Vishnuraj Ramakirshnan¹,Krishnan Balachander¹,Pullithadathil Biji¹^ORCID

Affiliation:

1. Nanotech Research, Innovation and Incubation Centre, PSG Institute of Advanced Studies, Coimbatore 641004, India

Funder

Department of Science and Technology, Ministry of Science and Technology, India

Publisher

American Chemical Society (ACS)

Subject

Electrical and Electronic Engineering,Materials Chemistry,Electrochemistry,Energy Engineering and Power Technology,Chemical Engineering (miscellaneous)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaem.1c01699

Reference38 articles.

1. Advanced loss analysis method for silicon wafer solar cells

2. Research and development efforts on texturization to reduce the optical losses at front surface of silicon solar cell

3. Highly Conformal Ni Micromesh as a Current Collecting Front Electrode for Reduced Cost Si Solar Cell

4. Metallization of crystalline silicon solar cells: A review

5. Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Narrow Line Width Ni–Cu–Sn Front Contact Metallization Patterns for Low‐Cost High‐Efficiency Crystalline Silicon Solar Cells using Nano‐Imprint Lithography;Energy Technology;2023-05-25

2. Process challenges of high-performance silicon heterojunction solar cells with copper electrodes;Solar Energy Materials and Solar Cells;2023-01

3. Maskless patterning of metal nanoparticles and silicon nanostructures by a droplet deposition and etching process;Materials Advances;2023

4. Copper Outdiffusion from Copper-Plated Solar Cell Contacts during Damp Heat Exposure;ACS Applied Materials & Interfaces;2022-03-03

5. Nanostructured Top Contact as an Alternative to Transparent Conductive Oxides in Tandem Perovskite/c-Si Solar Cells;Applied Sciences;2022-02-11