CF4 Plasma Treatment of Poly(dimethylsiloxane): Effect of Fillers and Its Application to High-Aspect-Ratio UV Embossing-Reference-Cited by-同舟云学术

CF4 Plasma Treatment of Poly(dimethylsiloxane): Effect of Fillers and Its Application to High-Aspect-Ratio UV Embossing

Published:2005-08-19 Issue:19 Volume:21 Page:8905-8912
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Yan Y. H.¹,Chan-Park M. B.¹,Yue C. Y.¹

Affiliation:

1. School of Chemical and Biomedical Engineering and The Singapore−MIT Alliance, Innovation in Manufacturing Systems and Technology Program, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la051580m

Reference42 articles.

1. Surface Texturing of PTFE Film Using Nonequilibrium Plasmas

2. Nonequilibrium Glow Discharge Fluorination of Polymer Surfaces

3. CF4 Plasma Treatment of Asymmetric Polysulfone Membranes

4. Plasmachemical Functionalization of Porous Polystyrene Beads

5. Super-hydrophobic Surfaces Produced by Plasma Fluorination of Polybutadiene Films

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