1. Adelmann, C.; Wen, L.
G.; Peter, A.
P.; Siew, Y.
K.; Croes, K.; Swerts, J.; Popovici, M.; Sankaran, K.; Pourtois, G.; Van Elshocht, S. In Alternative Metals for Advanced Interconnects, 2014 IEEE International Interconnect Technology Conference/Advanced Metallization Conference IITC/AMC 2014, 2014; pp 173–176.
2. Wen, L. G.; Adelmann, C.; Pedreira, O. V.; Dutta, S.; Popovici, M.; Briggs, B.; Heylen, N.; Vanstreels, K.; Wilson, C. J.; Van Elshocht, S. In Ruthenium Metallization for Advanced Interconnects, 2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference IITC/AMC 2016, 2016; pp 34–36.
3. Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
4. Thickness dependence of the resistivity of platinum-group metal thin films
5. Pedreira, O. V.; Croes, K.; Lesniewska, A.; Wu, C.; Van Der Veen, M. H.; De Messemaeker, J.; Vandersmissen, K.; Jourdan, N.; Wen, L.
G.; Adelmann, C. In Reliability Study on Cobalt and Ruthenium as Alternative Metals for Advanced Interconnects, IEEE International Reliability Physics Symposium, 2017; pp 6B2.1–6B2.8.