Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating
Author:
Affiliation:
1. College of Chemistry and Chemical Engineering, Chongqing University, Chongqing 400044, China
2. Hubei Xingfu Electronic Materials Co., Ltd, Yichang 443007, China
Publisher
American Chemical Society (ACS)
Subject
General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acsomega.3c05248
Reference27 articles.
1. FEA study on the TSV copper filling influenced by the additives and electroplating process
2. Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives
3. Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV
4. Review—Management of Copper Damascene Plating
5. Unraveling Adsorption Behaviors of Levelers for Bottom-Up Copper Filling in Through-Silicon-Via
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1. Numerical and experimental investigation of 2-thiazoline-2-thiol and nitrotetrazolium blue chloride compound as levelers for through-hole copper electroplating;Materials Today Communications;2024-08
2. Electroplated Copper Additives for Advanced Packaging: A Review;ACS Omega;2024-05-02
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