Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating-Reference-Cited by-同舟云学术

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Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Published:2020-03-03 Issue:10 Volume:5 Page:4868-4874
ISSN:2470-1343
Container-title:ACS Omega
language:en
Short-container-title:ACS Omega

Author:

Li Jing¹^ORCID,Zhou Guoyun¹,Hong Yan¹,Wang Chong¹,He Wei¹,Wang Shouxu¹,Chen Yuanming¹,Wen Zesheng²³,Wang Quanyong²³

Affiliation:

1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China

2. Ganzhou Sun&Lynn Circuit Co. Ltd., Ganzhou 341000, P. R. China

3. Shenzhen Sun&Lynn Circuit Co. Ltd., Shenzhen 518104, P. R. China

Funder

National Natural Science Foundation of China

Jiangxi Province

Publisher

American Chemical Society (ACS)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.acs.org/doi/pdf/10.1021/acsomega.9b03691

Reference44 articles.

1. Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers

2. A Synergy Effect of 2-MBT and PE-3650 on the Bottom-Up Filling in Electroless Copper Plating

3. Fundamental Study of Acid Copper Through‐Hole Electroplating Process

4. Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates

5. Solvent-dependent ultrasonic surface treatment on morphological reconstruction of CuO particles for copper electrodeposition

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1. Influence Mechanism of Synergistic Additives on the Nucleation and Coating Morphology and Structure of Copper Electronic Plating;CHEM J CHINESE U;2024

2. 1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-08

3. Effect of nitrogen-containing groups on the reduction of copper ions: In situ Raman and AIMD;Surfaces and Interfaces;2024-08

4. Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism;Applied Surface Science;2024-08

5. Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system;Journal of Industrial and Engineering Chemistry;2024-07

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