k-Restoring Processes at Carbon Depleted Ultralow-k Surfaces-Reference-Cited by-同舟云学术

k-Restoring Processes at Carbon Depleted Ultralow-k Surfaces

Published:2011-07-01 Issue:29 Volume:115 Page:8282-8287
ISSN:1089-5639
Container-title:The Journal of Physical Chemistry A
language:en
Short-container-title:J. Phys. Chem. A

Author:

Böhm Oliver¹,Leitsmann Roman²,Plänitz Philipp²,Radehaus Christian²,Schreiber Michael³,Schaller Matthias⁴

Affiliation:

1. Material Calculation, GWT-TUD GmbH, Annabergerstrasse 240, 09125 Chemnitz, Germany, and Institut für Physik, Technische Universität Chemnitz, 09107 Chemnitz, Germany

2. Material Calculation, GWT-TUD GmbH, Annabergerstrasse 240, 09125 Chemnitz, Germany

3. Institut für Physik, Technische Universität Chemnitz, 09107 Chemnitz, Germany

4. Dresden Module Two GmbH & Co. KG, GLOBALFOUNDRIES, 01109 Dresden, Germany

Publisher

American Chemical Society (ACS)

Subject

Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/jp202851p

Reference27 articles.

1. Low dielectric constant materials for microelectronics

2. Preparation and structure of porous dielectrics by plasma enhanced chemical vapor deposition

3. Characterization and integration of a CVD porous SiOCH (k<2.5) with enhanced mechanical properties for 65 nm CMOS interconnects and below

4. Nanocomposite Low-k SiCOH Films by Direct PECVD Using Vinyltrimethylsilane

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