Site-Selective Electroless Metallization on Porous Organosilica Films by Multisurface Modification of Alkyl Monolayer and Vacuum Plasma
Author:
Affiliation:
1. Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan
2. Department of Electronic Engineering, Hsiuping University of Science and Technology, Dali 412, Taichung, Taiwan
Publisher
American Chemical Society (ACS)
Subject
Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/la303473r
Reference45 articles.
1. Electrical characterization of a-InGaZnO thin-film transistors with Cu source/drain electrodes
2. Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD
3. All-wet fabrication process for ULSI interconnect technologies
4. A new seeding and electroless approach to alloying, direct patterning, and self-forming barriers for Cu thin-film nanostructures
5. Site-selective deposition of copper by controlling surface reactivity of SAMs with UV-irradiation
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