Use of a Thermally Degradable Chemical Vapor Deposited Polymer Film for Low Damage Plasma Processing of Highly Porous Dielectrics-Reference-Cited by-同舟云学术

Use of a Thermally Degradable Chemical Vapor Deposited Polymer Film for Low Damage Plasma Processing of Highly Porous Dielectrics

Published:2019-11-19 Issue:12 Volume:1 Page:2602-2611
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Marneffe Jean-François de¹^ORCID,Yamaguchi Tatsuya²,Fujikawa Makoto²,Rezvanov Askar¹³⁴,Chanson Romain¹,Zhang Jianran¹,Otell Ziad el¹,Babaei-Gavan Khashayar¹,Nozawa Syuji²,Kikuchi Yuki⁵,Maekawa Kaoru⁵

Affiliation:

1. imec v.z.w., 75 Kapeldreef, B-3001 Leuven, Belgium

2. Tokyo Electron Technology Solutions Limited, 650 Mitsuzawa, Yamanashi 407-0192, Japan

3. Moscow Institute of Physics and Technology (State University), Institutskiy per. 9, Dolgoprudny 141700, Russian Federation

4. Molecular Electronics Research Institute, 1st Zapadny Proezd 12/1, Zelenograd, Moscow, 124460, Russian Federation

5. TEL Technology Center, America, LLC, Albany, New York 12203, United States

Funder

H2020 Marie Sklodowska-Curie Actions

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.9b00589

Reference37 articles.

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2. Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics

3. Jiao, K.; Flynn, K. T.; Kohli, P. In Handbook of Nanoparticles; Aliofkhazraei, M., Ed. Springer International Publishing: Cham, 2016; pp 429–454.

4. SiOCH thin films deposited by chemical vapor deposition: From low-κ to chemical and biochemical sensors

5. Evaluating different classes of porous materials for carbon capture

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