Damage to porous SiCOH low-k dielectrics by O, N and F atoms at lowered temperatures-Reference-Cited by-同舟云学术

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Damage to porous SiCOH low-k dielectrics by O, N and F atoms at lowered temperatures

Published:2020-02-24 Issue:17 Volume:53 Page:175203
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Lopaev D V^ORCID,Zyryanov S M^ORCID,Zotovich A I^ORCID,Rakhimova T V,Mankelevich Yu A^ORCID,Voronina E N^ORCID

Funder

Russian Foundation for Basic Research

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1088/1361-6463/ab6e99/pdf

Reference78 articles.

1. Continuous formation of supported cubic and hexagonal mesoporous films by sol–gel dip-coating

2. Formation of Novel Oriented Transparent Films of Layered Silica-Surfactant Nanocomposites

3. A New Phase of Oriented Mesoporous Silicate Thin Films

4. Periodic Mesoporous Organosilicas: from simple to complex bridges; a comprehensive overview of functions, morphologies and applications

5. Advanced Interconnects for ULSI Technology

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1. Near-Plasma Chemical Surface Engineering;Nanomaterials;2024-01-15

2. Modification of Porous Ultralow-k Film by Vacuum Ultraviolet Emission;ACS Applied Electronic Materials;2022-06-08

3. Performance Analysis of CNT Bundle Interconnects in Various Low-k Dielectric Media;ECS Journal of Solid State Science and Technology;2022-06-01

4. Nanoporous SiOx plasma polymer films as carrier for liquid‐infused surfaces;Plasma Processes and Polymers;2022-04-22

5. Effect of H atoms and UV wideband radiation on cured low-k OSG films;Journal of Physics D: Applied Physics;2022-04-01

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