Damage to porous SiCOH low-k dielectrics by O, N and F atoms at lowered temperatures

Author:

Lopaev D VORCID,Zyryanov S MORCID,Zotovich A IORCID,Rakhimova T V,Mankelevich Yu AORCID,Voronina E NORCID

Funder

Russian Foundation for Basic Research

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Near-Plasma Chemical Surface Engineering;Nanomaterials;2024-01-15

2. Modification of Porous Ultralow-k Film by Vacuum Ultraviolet Emission;ACS Applied Electronic Materials;2022-06-08

3. Performance Analysis of CNT Bundle Interconnects in Various Low-k Dielectric Media;ECS Journal of Solid State Science and Technology;2022-06-01

4. Nanoporous SiOx plasma polymer films as carrier for liquid‐infused surfaces;Plasma Processes and Polymers;2022-04-22

5. Effect of H atoms and UV wideband radiation on cured low-k OSG films;Journal of Physics D: Applied Physics;2022-04-01

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