Funder
Fonds Wetenschappelijk Onderzoek
Publisher
Springer Science and Business Media LLC
Subject
General Physics and Astronomy,General Biochemistry, Genetics and Molecular Biology,General Chemistry
Reference100 articles.
1. International Roadmap for Devices and Systems (IRDS) — More Moore (IEEE, Piscataway, 2018).
https://irds.ieee.org/images/files/pdf/2018/2018IRDS_MM.pdf
.
2. Tokei, Z. et al. On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control. In 2016 IEEE Symposium on VLSI Technology, 1–2 (IEEE, 2016).
3. Ciofi, I. et al. Impact of wire geometry on interconnect RC and circuit delay. IEEE Trans. Electron Devices 63, 2488–2496 (2016).
4. Baklanov, M. R., Adelmann, C., Zhao, L. & De Gendt, S. Advanced interconnects: materials, processing, and reliability. ECS J. Solid State Sci. Technol. 4, Y1–Y4 (2014).
5. Maex, K. et al. Low dielectric constant materials for microelectronics. J. Appl. Phys. 93, 8793–8841 (2003).
Cited by
118 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献