Physical Mechanism of the Mechanical Bending of High-Performance Organic TFTs and the Effect of Atmospheric Factors-Reference-Cited by-同舟云学术

Physical Mechanism of the Mechanical Bending of High-Performance Organic TFTs and the Effect of Atmospheric Factors

Published:2022-06-02 Issue:6 Volume:4 Page:3000-3009
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Zheng Yu-Zhe¹,Chen Yu-An²,Chen Po-Hsun³^ORCID,Chang Ting-Chang²^ORCID,Hung Yang-Hao²,Zhou Kuan-Ju²,Tu Yu-Fa⁴,Wang Yu-Xuan⁵,Chen Jian-Jie²,Wu Chia-Chuan⁶,Sun Pei-Jun¹,Tsai Tsung-Ming¹,Tsai Chia-Hung⁷,Ogier Simon⁷

Affiliation:

1. Department of Materials and Optoelectronic Science, National Sun Yat-Sen University, Kaohsiung 804, Taiwan, R.O.C.

2. Department of Physics, National Sun Yat-Sen University, Kaohsiung 804, Taiwan, R.O.C.

3. Department of Applied Science, Chinese Naval Academy, Kaohsiung 813, Taiwan, R.O.C.

4. Department of Electronics Engineering, National Tsing Hua University, Hsinchu 300, Taiwan, R.O.C.

5. Department of Electronics Engineering, National Yang Ming Chiao Tung University, Hsinchu 300, Taiwan, R.O.C.

6. Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung 804, Taiwan, R.O.C.

7. SmartKem Ltd., Hexagon Tower Blackley, Manchester M9 8GQ, U.K.

Funder

Ministry of Science and Technology, Taiwan

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.2c00430

Reference41 articles.

1. Review of flexible and transparent thin-film transistors based on zinc oxide and related materials

2. Recent advances in triboelectric nanogenerator based self-charging power systems

3. Flexible transparent high-voltage diodes for energy management in wearable electronics

4. The mechanical bending effect and mechanism of high performance and low-voltage flexible organic thin-film transistors with a cross-linked PVP dielectric layer

5. Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

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