Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices-Reference-Cited by-同舟云学术

Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

Published:2021-01-25 Issue:5 Volume:8 Page:2001662
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Taguchi Ryo¹²^ORCID,Akamatsu Norihisa¹²,Kuwahara Kohei¹²,Tokumitsu Kayoko¹²,Kobayashi Yoshiaki¹²,Kishino Masayuki¹²,Yaegashi Keita³⁴,Takeya Jun³⁴,Shishido Atsushi¹²^ORCID

Affiliation:

1. Laboratory for Chemistry and Life Science Institute of Innovative Research Tokyo Institute of Technology Yokohama 226‐8503 Japan

2. Department of Chemical Science and Engineering School of Materials and Chemical Technology Tokyo Institute of Technology Meguro Tokyo 152‐8552 Japan

3. Material Innovation Research Center (MIRC) Graduate School of Frontier Sciences The University of Tokyo Kashiwa Chiba 277‐8561 Japan

4. Department of Advanced Materials Science Graduate School of Frontier Sciences The University of Tokyo 5‐1‐5 Kashiwanoha, Kashiwa Chiba 277‐8561 Japan

Funder

Core Research for Evolutional Science and Technology

Japan Society for the Promotion of Science

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202001662

Reference43 articles.

1. Programmable and adaptive mechanics with liquid crystal polymer networks and elastomers

2. Functional Liquid-Crystalline Assemblies: Self-Organized Soft Materials