Recyclable in-mold and printed electronics with polymer separation layers-Reference-Cited by-同舟云学术

Recyclable in-mold and printed electronics with polymer separation layers

Published:2024 Issue:6 Volume:2 Page:1883-1894
ISSN:2753-8125
Container-title:RSC Sustainability
language:en
Short-container-title:RSC Sustain.

Author:

Brasse Yannic¹^ORCID,Laguna Moreno Mariano¹,Blum Simon¹,Horter Tim²,Janek Florian²,Gläser Kerstin²,Emmerechts Carl³,Clanet Jean-Michel⁴,Verhaert Michèle⁴,Grymonprez Benoît⁴,Kraus Tobias¹⁵^ORCID

Affiliation:

1. INM – Leibniz Institute for New Materials, Structure Formation Group, Campus D2 2, 66123 Saarbrücken, Germany

2. Hahn-Schickard-Gesellschaft für angewandte Forschung, Allmandring 9b, 70569 Stuttgart, Germany

3. Sirris, Liège Science Park, Rue Bois Saint-Jean 12, 4102 Seraing, Belgium

4. CTP Centre Terre et Pierre, Chau. d'Antoing 55, 7500 Tournai, Belgium

5. Saarland University, Colloid and Interface Chemistry, Campus D2 2, 66123 Saarbrücken, Germany

Abstract

Polymer separation layers facilitate the disassembly and recycling of composites made from printed electronics.

Funder

Allianz Industrie Forschung

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/SU/D4SU00092G

Reference35 articles.

1. Radio frequency identification enabled wireless sensing for intelligent food logistics

2. The role of printed electronics and related technologies in the development of smart connected products

3. A New Frontier of Printed Electronics: Flexible Hybrid Electronics

4. The need for design-for-recycling of paper-based printed electronics – a prospective comparison with printed circuit boards

5. Environmental evaluation of new technology: printed electronics case study