Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites
Author:
Affiliation:
1. Department of Mechanical Engineering and ‡Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States
Funder
Air Force Office of Scientific Research
National Science Foundation
U.S. Department of Energy
Northrop Grumman
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.5b05147
Reference57 articles.
1. Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials
2. A metallization and bonding approach for high performance carbon nanotube thermal interface materials
3. Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites with High Packing Density
4. Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature
5. Thermal and Structural Characterizations of Individual Single-, Double-, and Multi-Walled Carbon Nanotubes
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