N-MOSFETs Formed on Solid Phase Epitaxially Grown GeSn Film with Passivation by Oxygen Plasma Featuring High Mobility
Author:
Affiliation:
1. Department of Engineering and System Science, National Tsing Hua University, 300 Hsinchu, Taiwan
Funder
Ministry of Science and Technology, Taiwan
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.5b08518
Reference31 articles.
1. Hole Mobility Enhancement in Compressively Strained ${\rm Ge}_{0.93}{\rm Sn}_{0.07}$ pMOSFETs
2. GeSn channel nMOSFETs: Material potential and technological outlook
3. (Invited) GeSn Channel n and p MOSFETs
4. Guo, P.; Zhan, C.; Yang, Y.; Gong, X.; Liu, B.; Cheng, R.; Wang, W.; Pan, J.; Zhang, Z.; Tok, E. S.; Han, G.; Yeo, Y. C.Germanium-Tin (GeSn) N-Channel MOSFETs with Low Temperature Silicon Surface Passivation. InInternational Symposium on VLSI Technology Systems and Applications (VLSI-TSA);Hsinchu, Taiwan, April 22–-24, 2013;IEEE:Piscataway, NJ, 2013; Vol.75, pp1–2.
5. Towards high mobility GeSn channel nMOSFETs: Improved surface passivation using novel ozone oxidation method
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