Preparation of Hexagonal Boron Nitride-Containing Foam with Improved Thermal Conductivity of Epoxy Resins-Reference-Cited by-同舟云学术

Preparation of Hexagonal Boron Nitride-Containing Foam with Improved Thermal Conductivity of Epoxy Resins

Published:2023-02-06 Issue:3 Volume:5 Page:1786-1796
ISSN:2637-6105
Container-title:ACS Applied Polymer Materials
language:en
Short-container-title:ACS Appl. Polym. Mater.

Author:

Wang Zhanyi¹²^ORCID,Wang Xuan¹²,Zhang Zhonghua¹²,Liang Liang¹²,Zhao Zhihang³

Affiliation:

1. Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, 52 Xuefu Road, Harbin, Heilongjiang 150080, P. R. China

2. School of Electrical and Electronic Engineering, Harbin University of Science and Technology, 52 Xuefu Road, Harbin, Heilongjiang 150080, P. R. China

3. Department of Electrical Engineering and Applied Electronics, Tsinghua University, 30 Shuangqing Road, Haidian District, Beijing 100084, P. R. China

Funder

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

https://pubs.acs.org/doi/pdf/10.1021/acsapm.2c01885

Reference65 articles.

1. Highly thermally conductive polymer composite enhanced by two-level adjustable boron nitride network with leaf venation structure

2. Engineering the Thermal Conductivity of Functional Phase‐Change Materials for Heat Energy Conversion, Storage, and Utilization

3. Cotton Candy-Templated Fabrication of Three-Dimensional Ceramic Pathway within Polymer Composite for Enhanced Thermal Conductivity