Thermal conductivity and dielectric properties of EP composites filled by one-dimensional core-shell structured h-BN@SiO2 fibers
Author:
Funder
Natural Science Foundation of Heilongjiang Province
Key Research and Development Program of Hunan Province of China
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference57 articles.
1. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging;Li;Mater. Today Phys.,2022
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3. Flexible h-BN/fluorinated poly (arylene ether nitrile) fibrous composite film with low dielectric constant and high thermal conductivity fabricated via coaxial electrospinning hot-pressing technique;Yang;Colloid Surf. A-Physicochem. Eng. Asp.,2022
4. Enhanced thermal conductivity of epoxy composites by introducing 1D AlN whiskers and constructing directionally aligned 3D AlN filler skeletons;Hao;ACS Appl. Mater. Interfaces,2023
5. Novel functionalized BN nanosheets/epoxy composites with advanced thermal conductivity and mechanical properties;Liu;ACS Appl. Mater. Interfaces,2020
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