Highly Thermal Conductivities, Excellent Mechanical Robustness and Flexibility, and Outstanding Thermal Stabilities of Aramid Nanofiber Composite Papers with Nacre-Mimetic Layered Structures-Reference-Cited by-同舟云学术

Highly Thermal Conductivities, Excellent Mechanical Robustness and Flexibility, and Outstanding Thermal Stabilities of Aramid Nanofiber Composite Papers with Nacre-Mimetic Layered Structures

Published:2019-12-10 Issue:1 Volume:12 Page:1677-1686
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Ma Tengbo,Zhao Yongsheng,Ruan Kunpeng,Liu Xirui,Zhang Junliang¹^ORCID,Guo Yongqiang,Yang Xutong,Kong Jie^ORCID,Gu Junwei^ORCID

Affiliation:

1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, P. R. China

Funder

Ministry of Education of the People's Republic of China

Henan University of Science and Technology

National Natural Science Foundation of China

Northwestern Polytechnical University

Natural Science Basic Research Plan for Distinguished Young Scholars in Shaanxi Province of China

Natural Science Basic Research Plan in Shaanxi Province of China

Undergraduate Innovation & Business Program in Northwestern Polytechnical University

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.9b19844

Reference52 articles.

1. High-Performance and Rapid-Response Electrical Heaters Based on Ultraflexible, Heat-Resistant, and Mechanically Strong Aramid Nanofiber/Ag Nanowire Nanocomposite Papers

2. Electrospun nanofiber: Emerging reinforcing filler in polymer matrix composite materials

3. Flexible Films for Smart Thermal Management: Influence of Structure Construction of a Two-Dimensional Graphene Network on Active Heat Dissipation Response Behavior

4. Reactive Aramid Nanostructures as High-Performance Polymeric Building Blocks for Advanced Composites

5. Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics

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