Optimization of Interface Materials between Bi<sub>2</sub>Te<sub>3</sub>-Based Films and Cu Electrodes Enables a High Performance Thin-Film Thermoelectric Cooler-Reference-Cited by-同舟云学术

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Optimization of Interface Materials between Bi₂Te₃-Based Films and Cu Electrodes Enables a High Performance Thin-Film Thermoelectric Cooler

Published:2022-04-27 Issue:18 Volume:14 Page:21106-21115
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Shen Limei¹²,Chen Yixin¹,Niu Bingxuan¹,Liu Zeyu¹,Qin Jiang³,Xie Junlong¹^ORCID

Affiliation:

1. School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

2. Shenzhen Huazhong University of Science and Technology Research Institute, Shenzhen 518057, China

3. School of Energy Science and Engineering, Harbin Institute of Technology, Harbin 150001, China

Funder

Science, Technology and Innovation Commission of Shenzhen Municipality

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.1c24603

Reference27 articles.

1. The practical performance forecast and analysis of thermoelectric module from macro to micro

2. Performance analysis and assessment of thermoelectric micro cooler for electronic devices

3. Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 legs for power generation applications

4. Controllable Electrical Contact Resistance between Cu and Oriented-Bi2Te3 Film via Interface Tuning

5. Current progress and future challenges in thermoelectric power generation: From materials to devices

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simultaneous optimization of cooling temperature difference and efficiency for multi-stage thermoelectric device;Applied Energy;2024-11

2. Understanding interfacial compounds induced by Ag diffusion on improving interface electrical contact resistivity between the Cu electrode and Bi2Te3 thin film;Journal of Alloys and Compounds;2024-10

3. Localized Surface Doping Induced Ultralow Contact Resistance between Metal and (Bi,Sb)₂Te₃ Thermoelectric Films;ACS Applied Materials & Interfaces;2024-06-27

4. Atomic-Resolution Interfacial Reaction Mechanism between Bi₂Te₃-Based Alloys and Ni Electrodes;ACS Applied Materials & Interfaces;2024-05-31

5. Co-optimization of electrical-thermal–mechanical behaviors of an on-chip thermoelectric cooling system using response surface method;Applied Thermal Engineering;2024-05

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