Author:
Cai Yang,Liu Di,Zhao Fu-Yun,Tang Jian-Feng
Funder
National Natural Science Foundation of China
Hong Kong Scholar Program
China Postdoctoral Science Foundation
Qingdao Postdoctoral Science Foundation
Fundamental Research Funding Program for National Key Universities in China
CCP Central Committee
Hunan Provincial Government
Hubei Provincial Natural Science Foundation of Hubei Province
Scientific Research Foundation for the Returned Overseas Chinese Scholars
National Key Basic Research Program of China
Ministry of Science and Technology of China
Subject
Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment
Reference29 articles.
1. High resolution thermal simulation of electronic components;Hanreich;Microelectron Reliab,2000
2. Thermal frontiers in the design and packaging microelectronic equipment;Bar-Cohen;Mech Eng,1983
3. Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling;Zhang,2003
4. Thermoelectric cooler application in electronic cooling;Chein;Appl Therm Eng,2004
5. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package;Wang;Energy Convers Manage,2015
Cited by
82 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献