Funder
National Natural Science Foundation of China
Reference49 articles.
1. Thermal challenges in next-generation electronic systems;Garimella;IEEE Trans. Compon. Packag. Technol.,2008
2. DARPA’s intra/interchip enhanced cooling (ICECool) program;Bar-Cohen1;CS MANTECH Conference.,2013
3. Thermoelectric coolers;Savage;Nat. Photonics.,2009
4. N.Y. Wen, Application of thermo electric cooler (TEC) in avionics for thermal management, in: Digital Avionics Systems Conference (DASC), 2015 IEEE/AIAA 34th, IEEE, 2015, pp. 1-29.
5. Optimal design of thermoelectric cooling system integrated heat pipes for electric devices;Liu;Energy.,2017
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