Postpolymerization of Functional Organosiloxanes: An Efficient Strategy for Preparation of Low-k Material with Enhanced Thermostability and Mechanical Properties
Author:
Affiliation:
1. Key Laboratory of Synthetic and Self-Assembly Chemistry for Organic Functional Molecules, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences, 345 Lingling Road, Shanghai 200032, People’s Republic of China
Funder
National Natural Science Foundation of China
Ministry of Science and Technology of the People's Republic of China
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/ma501263c
Reference29 articles.
1. New polymers derived from 4-vinylsilylbenzocyclobutene monomer with good thermal stability, excellent film-forming property, and low-dielectric constant
2. Structural Characterization of Mesoporous Organosilica Films for Ultralow-k Dielectrics
3. Low Dielectric Constant Materials
4. Amine Dendrimers as Templates for Amorphous Silicas
5. A new low dielectric material with high thermostability based on a thermosetting trifluoromethyl substituted aromatic molecule
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