Structural Characterization of Mesoporous Organosilica Films for Ultralow-k Dielectrics-Reference-Cited by-同舟云学术

Structural Characterization of Mesoporous Organosilica Films for Ultralow-k Dielectrics

Published:2003-04-11 Issue:18 Volume:107 Page:4280-4289
ISSN:1520-6106
Container-title:The Journal of Physical Chemistry B
language:en
Short-container-title:J. Phys. Chem. B

Author:

de Theije Femke K.¹,Balkenende A. Ruud¹,Verheijen Marcel A.¹,Baklanov Mikhail R.¹,Mogilnikov Konstantin P.¹,Furukawa Yukiko¹

Affiliation:

1. Philips Research Laboratories, Prof. Holstlaan 4 (WA11), 5656 AA Eindhoven, The Netherlands, Philips Centre for Industrial Technology, Prof. Holstlaan 4 (WY42), 5656 AA Eindhoven, The Netherlands, XPEQT at IMEC, Kapeldreef 75, B-3001 Leuven, Belgium, and Philips Research Leuven, Kapeldreef 75, B-3001 Leuven, Belgium

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/jp027701y

Reference33 articles.

1. International TechnologyRoad mapfor Semiconductors; Semiconductor Industry Association: Austin, TX, 2001.

2. The future of interconnection technology

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