Fracture mechanics analysis of three-dimensional ion cut technology
Author:
Publisher
Mathematical Sciences Publishers
Subject
Applied Mathematics,Mechanics of Materials
Link
http://msp.org/jomms/2007/2-9/jomms-v2-n9-p11-s.pdf
Reference24 articles.
1. Transfer of structured and patterned thin silicon films using the Smart-Cut® process
2. Smart-Cut® process using metallic bonding: Application to transfer of Si, GaAs, InP thin films
3. Silicon on insulator material technology
4. Application of hydrogen ion beams to Silicon On Insulator material technology
5. Asymptotic solution for a penny-shaped near-surface hydraulic fracture
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