Finding Solutions to the Challenges in Package Interconnect Reliability
Author:
Publisher
Intel
Subject
General Materials Science
Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Impact of back-end-of-line architecture on chip-package-interaction in advanced interconnects;Microelectronics Reliability;2020-09
2. Failures of electronic devices: solder joints failure modes, causes and detection methods;Handbook of Materials Failure Analysis;2020
3. Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review;Progress in Adhesion and Adhesives;2019-06-28
4. Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni;Journal of Alloys and Compounds;2018-10
5. The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading;Journal of Electronic Materials;2014-07-22
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