Multistep, In-Situ Single Wafer Processing - Materials, Device and Equipment Issues-Reference-Cited by-同舟云学术

Multistep, In-Situ Single Wafer Processing - Materials, Device and Equipment Issues

Published:1989 Issue: Volume:146 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Hauser J. R.,Masnari N. A.,Littlejohn M. A.

Abstract

ABSTRACTMultistep, in-situ single wafer processing is being explored as an alternative processing approach to standard batch silicon wafer processing. Advantages and disadvantages of this approach are explored and an evaluation given of the potential for future advanced, low temperature wafer processing. Multistep, single wafer processing offers many advantages for advanced device and IC development but much technology research and equipment development is needed to achieve its potential.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

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