Microwave Plasma LPCVD of Tungsten in a Cold-Wall Lamp-Heated Rapid Thermal Processor

Author:

Moslehi Mehrdad M.,Saraswat Krishna C.,Shatas Steven C.

Abstract

ABSTRACTA novel cold-wall single-wafer lamp-heated Rapid Thermal/Microwave Remote Plasma Multiprocessing (RTMRPM) reactor has been developed for multilayer in-situ growth and deposition of dielectrics, silicon, and metals. This equipment is the result of an attempt to enhance semiconductor processing equipment versatility, to improve process reproducibility and uniformity, to increase growth and deposition rates at reduced processing temperatures, and to achieve in-situ multiprocessing in conjunction with real-time process monitoring and automation. For high-performance MOS VLSI applications, a variety of selective and nonselective tungsten deposition processes were investigated in this work. The tungsten gate MOS devices fabricated using the remote plasma multiprocessing techniques exhibited negligible plasma damage and near-ideal electrical characteristics. The flexibility of the reactor allows optimization of each process step yet allows multiprocessing.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference10 articles.

1. [10] Wong M. , Submitted to IEEE Electron Device Letters.

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3. A new tungsten gate process for VLSI applications

4. [6] Moslehi M. M. , 1987 Symp. on VLSI Technol., (Japan) 1987.

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