Ultra-Shallow Junctions by Ion Implantation and Rapid Thermal Annealing: Spike-Anneals, Ramp Rate Effects

Author:

Agarwal Aditya,Gossmann Hans-J.,Fiory Anthony T.

Abstract

ABSTRACTOver the last couple of years rapid thermal annealing (RTA) equipment suppliers have been aggressively developing lamp-based furnaces capable of achieving ramp-up rates on the order of hundreds of degrees per second. One of the driving forces for adopting such a strategy was the experimental demonstration of 30nm p-type junctions by employing a ramp-up rate of ≈400°C/s. It was subsequently proposed that the ultra-fast temperature ramp-up was suppressing transient enhanced diffusion (TED) of boron which results from the interaction of the implantation damage with the dopant. The capability to achieve very high temperature ramp-rates was thus embraced as an essential requirement of the next generation of RTA equipment.In this paper, recent experimental data examining the effect of the ramp-up rate during spike-and soak-anneals on enhanced diffusion and shallow junction formation is reviewed. The advantage of increasing the ramp-up rate is found to be largest for the shallowest, 0.5-keV, B implants. At such ultra-low energies (ULE) the advantage arises from a reduction of the total thermal budget. Simulations reveal that a point of diminishing return is quickly reached when increasing the ramp-up rate since the ramp-down rate is in practice limited. At energies where TED dominates, a high ramp-up rate is only effective in minimizing diffusion if the implanted dose is sufficiently small so that the TED can be run out during the ramp-up portion of the anneal; for larger doses, a high ramp-up rate only serves to postpone the TED to the ramp-down duration of the anneal. However, even when TED is minimized at higher implant energies via high ramp-up rates, the advantage is unobservable due to the rather large as-implanted depth. It appears then that while spike anneals allow the activation of ULE-implanted dopants to be maximized while minimizing their diffusion the limitation imposed by the ramp-down rate compromises the advantage of very aggressive ramp-up rates.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Low-temperature activation of boron ion in silicon substrate using B10H14 + cluster and by soft X-ray irradiation;Japanese Journal of Applied Physics;2018-10-12

2. Ion Implantation;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09

3. Molecular Dynamics Study of Explosive Crystallization of SiGe and Boron-Doped SiGe Alloys;Industrial & Engineering Chemistry Research;2006-03-02

4. Optimal control of rapid thermal annealing in a semiconductor process;Journal of Process Control;2004-06

5. Influence of hydrogen plasma treatment on boron implanted junctions in silicon;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2003

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