Self-Interstitial Supersaturation During Ostwald Ripening of End-of-Range Defects in Ion-Implanted Silicon

Author:

Seibt M.

Abstract

AbstractModified Ostwald ripening theory is used to calculate the time evolution of the size distribution function of extended end-of-range defects in ion implanted silicon. This allows to compare the time dependent self-interstitial supersaturation during postimplantation annealing in the presence of Frank-type stacking faults with that in the presence of {311} - defects. It is shown that the latter affect self-interstitial concentrations up to the point where they dissolve whereas the former are irrelevant from the point of view of transient enhanced diffusion.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference19 articles.

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2. [14] This approximation holds after an initial transient τ of the order of τ ≅ d 2 /D 1 . During this transient SiI diffusion into the bulk will be of the same order of magnitude as transport into the bulk. At larger times the steeper concentration gradient towards the surface dominates. For typical values of d (≅ 100nnm) and DI (> 10−1 cm 2 /s)τ is less than 1s.

3. [11] The growth kinetis are valid for a plate-shaped precipitate of constant thickness which grows exclusively by incorporation of atoms via the bounding dislocation.

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