Author:
Keller R.-M.,Kuschke W.-M.,Kretschmann A.,Bader S.,Vinci R.P.,Arzt E.
Abstract
AbstractSubstrate curvature and X-ray technique were used to study the mechanical properties of Cu films. Stress-temperature curves were measured using both methods. An additional analysis of the X-ray peak width allows us to estimate grain size and dislocation density as a function of temperature. It can be shown that a capping layer changes the mechanical properties of a Cu film strongly and that in capped films dislocation processes seem to be more important than diffusion at high temperatures.
Publisher
Springer Science and Business Media LLC
Cited by
7 articles.
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