Funder
Semiconductor Research Corporation
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference17 articles.
1. S. Mokler, R. Aspandiar, K. Byrd, O. Chen, S. Walwadkar, The application of Bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems, in Proceeding of SMTA International
2. L. Shen, P. Lu, S. Wang, Z. Chen, Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique. J. Alloys Compd. 574, 98–103 (2013). https://doi.org/10.1016/j.jallcom.2013.04.057
3. L. Shen, P. Septiwerdani, Z. Chen, Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation. Mater. Sci. Eng. A 558, 253–258 (2012). https://doi.org/10.1016/j.msea.2012.07.120
4. Z. Zhou, X. Ma, M.B. Zhou, C. Yin, X.P. Zhang, Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy, in 18th International Conference on Electronic Packaging Technology, ICEPT 2017 (2017), pp. 1586–1591. https://doi.org/10.1109/ICEPT.2017.8046739
5. X. Hu, X. Yu, Y. Li, Q. Huang, Y. Liu, Z. Min, Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints. J. Mater. Sci.: Mater. Electron. 25(1), 57–64 (2014). https://doi.org/10.1007/s10854-013-1548-9
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献