Funder
Semiconductor Research Corporation
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. S. Mokler, R. Aspandiar, K. Byrd, O. Chen, and S. Walwadkar, The application of Bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems. In Proceeding of SMTA International, pp. 318–326 (2016).
2. M. Mccormack, H.S. Chen, G.W. Kammlott, and S. Jin, Significantly improved mechanical properties of Bi-Sn solder alloys by Ag-doping. J. Electron. Mater. 26, 954–958 (1997). https://doi.org/10.1007/S11664-997-0281-7.
3. L. Shen, P. Septiwerdani, and Z. Chen, Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation. Mater. Sci. Eng. A 558, 253–258 (2012). https://doi.org/10.1016/j.msea.2012.07.120.
4. K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys. J. Electron. Mater. 29, 1122–1136 (2000). https://doi.org/10.1007/s11664-000-0003-x.
5. P.J. Shang, Z.Q. Liu, D.X. Li, and J.K. Shang, TEM observations of the growth of intermetallic compounds at the SnBi/Cu interface. J. Electron. Mater. 38, 2579–2584 (2009). https://doi.org/10.1007/S11664-009-0894-0.