Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference33 articles.
1. Characterization of eutectic Sn-Bi solder joints
2. F. Hua, Z. Mei, J. Glazer, Eutectic Sn–Bi as an alternative Pb-free solder, in: 48th Electronic Components and Technology Conference, vol. 227, 1998.
3. Nanoindentation of lead-free solders in microelectronic packaging
4. Room-temperature indentation creep of lead-free Sn–Bi solder alloys
5. Solid solution creep behavior of Sn-xBi alloys
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