Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique-Reference-Cited by-同舟云学术

Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique

Published:2013-10 Issue: Volume:574 Page:98-103
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Shen Lu,Lu Pin,Wang Shijie,Chen Zhong

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference33 articles.

1. Characterization of eutectic Sn-Bi solder joints

2. F. Hua, Z. Mei, J. Glazer, Eutectic Sn–Bi as an alternative Pb-free solder, in: 48th Electronic Components and Technology Conference, vol. 227, 1998.

3. Nanoindentation of lead-free solders in microelectronic packaging

4. Room-temperature indentation creep of lead-free Sn–Bi solder alloys

5. Solid solution creep behavior of Sn-xBi alloys

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