Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Abstract

AbstractThe dissolution process of nickel in liquid Pb-free 87.5% Sn-7.5% Bi-3% In-1% Zn-1% Sb and 80% Sn-15% Bi-3% In-1% Zn-1% Sb soldering alloys has been investigated by the rotating disc technique at 250-450°C. The temperature dependence of the nickel solubility in the solders obeys a relation of the Arrhenius type cs = 4.94 × 102 exp (-39500/RT) % for the former alloy and cs = 4.19 × 102 exp (-40200/RT)% for the latter, where R is in J mol-1 K-1 (8.314 J mol-1 K-1) and T in K. The solubility values of nickel in the alloys differ considerably, while the dissolution rate constants are rather close. The data presented can be used to evaluate (i) the thickness of the dissolved portion of the solid nickel material during soldering, (ii) the extent of saturation of a solder with nickel and (iii) the effect of dissolution on the growth rate of intermetallic layers at the Ni-solder interface.