Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles-Reference-Cited by-同舟云学术

Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles

Published:2011-06-28 Issue:3 Volume:23 Page:140-149
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Arafat M.M.,Haseeb A.S.M.A.,Rafie Johan Mohd

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference34 articles.

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