Electromigration Damage in Conductor Lines: Recent Progress in Microscopic Observation and Mechanistic Modelling

Author:

Arzt E.,Kraft O.,MÖckl U.E.

Abstract

ABSTRACTIn this paper an overview of recent developments in understanding electromigration damage mechanisms is given. Based on our detailed studies, both ex-situ and in-situ, of damage in unpassivated near-bamboo lines, we develop a theoretical electromigration damage map. It explains why “slit-like” failure becomes predominant for narrow lines and low current densities. The mechanism of slit formation is discussed in the light of new analytical and numerical simulations of pore shape changes, which take stress effects into account. Possible implications for the rational design of improved metallization alloys are suggested.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

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