Hardness and Adhesion Measurements of Copper Metallizations by a Continuous Indentation Approach-Reference-Cited by-同舟云学术

Hardness and Adhesion Measurements of Copper Metallizations by a Continuous Indentation Approach

Published:1990 Issue: Volume:203 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Lafontaine W.R.,Li Che-Yu

Abstract

ABSTRACTA continuous indentation test has been used to evaluate the difference in adhesion between copper films deposited on oxidized silicon substrates with different transition metalinterlayers. Variations in adhesion between samples with interlayers of Al,Cr,Ni,Ti and V correlated with the free energy of formation of the particular metal oxide present.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference7 articles.

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3. 6. LaFontaine W.R. , Ph.D Dissertation, Cornell Univ, (1990).

4. A method for interpreting the data from depth-sensing indentation instruments

5. An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation test

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