Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions
2. Measurements of the debond energy for thin metallization lines on dielectrics
3. Adhesion Assessment of Copper Thin Films
4. High‐temperature interaction studies of C/Cu/SiO2/Si and related structures
5. Mechanism of adhesion improvement in ion-beam mixed Cu/SiO2
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